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传感器模块采用全焊接技术，内部拥有一个整体化的过载膜片，一个压力传感器和一个温度传感器。温度传感器作为温度补偿的参考值。压力传感器的正压侧与传感器膜盒的高压腔相连，传感器的负压侧与传感器膜盒的低压腔相连，压力通过隔离膜片和填充液，传递给传感器内的硅芯片，使压力传感器的芯片的阻值发生变化，从而导致检测系统输出电压变化。该输出电压与压力变化成正比，再由适配单元和放大器转化成一标准化信号输出。
The sensor module adopts full welding technology, and has an integral overload diaphragm, a pressure sensor and a temperature sensor. Temperature sensors are used as reference values for temperature compensation. The positive pressure side of the pressure sensor is connected with the high pressure chamber of the sensor diaphragm box, and the negative pressure side of the sensor is connected with the low pressure chamber of the sensor diaphragm box. The pressure is transmitted to the silicon chip in the sensor through isolating diaphragm and filling liquid, which changes the resistance value of the chip of the pressure sensor, thus leading to the change of the output voltage of the detection system. The output voltage is proportional to the pressure change, and then converted from the adapter unit and amplifier into a standardized signal output.